Electronic Components Failure Analysis: Methods and Experience for Beginners - Paperback
Electronic Components Failure Analysis: Methods and Experience for Beginners - Paperback
Details
by Tsai Feng Sung (Author)
Electronic Components Failure Analysis for Beginners: Methods and Experience
A Practical Guide to Instrument-Based Failure Diagnosis for Beginners
This book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis.
The colorful graphic analysis report allows you to absorb the author's years of experience. Beginners can learn a lifetime's worth of analysis tools in one go and quickly accumulate a year's worth of expertise.
Content includes:
BGA analysis
DYE and PRY test
2D/3D X-ray analysis
Silver migration analysis
EDX energy dispersive spectroscopy reports
Sulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysis
Soldering ability test
FTIR Fourier transform infrared spectrometer reports
XRF fluorescent X-ray hazardous substance analyzer reports
LED popcorn stress failure
Electrostatic damage
C-SAM ultrasonic inspection
And various component failure analysis reports.
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